MosChip Technologies Ltd has announced a collaboration with EMASS to advance silicon implementation for next-generation Edge AI system-on-chip (SoC) solutions. The partnership aims to deliver ultra-low power, always-on intelligence for edge devices, targeting applications in medical wearables, IoT sensors, and other compact connected systems.
MosChip Technologies Ltd, a leading semiconductor and design services company, has entered into a strategic collaboration with EMASS, a Nanoveu subsidiary, to work on silicon implementation for breakthrough Edge AI SoC solutions. EMASS recently unveiled its ECS-DoT chip, designed to provide milliWatt-scale intelligence for edge devices, eliminating reliance on cloud-based computation. The partnership is expected to accelerate innovation in edge computing by combining MosChip’s silicon expertise with EMASS’s advanced AI architecture.
Key highlights from the announcement include
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MosChip will collaborate with EMASS on silicon implementation for Edge AI SoC.
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EMASS’s ECS-DoT chip delivers always-on, ultra-low power intelligence for edge devices.
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Applications include medical wearables, IoT sensors, and compact connected devices powered by small batteries.
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The chip features four megabytes of on-board SRAM, enabling efficient AI computations locally.
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The collaboration strengthens MosChip’s position in the global semiconductor ecosystem and supports India’s ambition in deep-tech innovation.
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The initiative reflects growing demand for AI-powered edge solutions across healthcare, industrial automation, and consumer electronics.
This partnership underscores the importance of localized intelligence in edge devices, reducing dependency on cloud infrastructure while enhancing efficiency and security. By leveraging MosChip’s design capabilities and EMASS’s cutting-edge technology, the collaboration is poised to deliver scalable solutions for the next wave of AI-driven applications.
Sources: Rediff MoneyWiz, EMASS Press Release, Electronic Specifier