Taiwan Semiconductor Manufacturing Company (TSMC) has successfully fabricated seven semiconductor designs, including a 12nm chip, under India’s Design Linked Incentive (DLI) scheme. This milestone marks a significant step in India’s semiconductor ambitions, showcasing early success in startup-led innovation and global collaboration in chip manufacturing.
A Boost For India’s Semiconductor Vision
The chips were developed by Indian startups supported through the DLI scheme, part of the Semicon India Programme. These designs, ranging from basic to advanced nodes like 12nm, were fabricated by TSMC, the world’s leading chip foundry. The initiative aims to build a robust domestic chip design ecosystem by offering financial and technical support to emerging companies.
From Tape-Out To Silicon
The successful tape-out and fabrication of these chips demonstrate the viability of India’s design capabilities. The chips are now undergoing post-silicon validation, a critical phase before commercial deployment. The government highlighted this achievement in the Lok Sabha, emphasizing its commitment to nurturing innovation and reducing reliance on imported technologies.
Strategic Implications
This development signals growing confidence in India’s semiconductor roadmap. With global players like TSMC involved, the DLI scheme is gaining traction and credibility. It also reflects India’s potential to become a competitive player in the global chip supply chain.
Key Highlights
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Seven chip designs fabricated under DLI scheme
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Includes advanced 12nm node
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Developed by Indian startups
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Fabrication by TSMC, a global leader
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Post-silicon validation underway
Conclusion
TSMC’s fabrication of seven chips under India’s DLI scheme is a landmark achievement for the country’s semiconductor strategy. It underscores the success of public-private collaboration and sets the stage for future breakthroughs in chip design and manufacturing.
Sources: The Economic Times, Swarajya, ETtech